PCB Design & Layout Engineering
Schematic capture, multi-layer routing, impedance matching, DRC inspection, and fabrication files.
End-to-End PCB Capabilities
- Single-sided to 6-layer high-speed digital and RF microstrip routing
- IPC-7351 footprint standards and high-density packaging (QFN, BGA, 0402)
- Power integrity (PI) and signal integrity (SI) analysis
- Complete fabrication package: Gerber RS-274X, Drill files, Pick & Place, BOM